发明名称 |
Method and apparatus for uniform direct radiant heating in a rapid thermal processing reactor |
摘要 |
Method and apparatus for uniform direct radiant heating in a rapid thermal processing reactor where uniformity of temperature across the width and breadth of a semiconductor wafer is achieved by placement of a dome-shaped thermal insert in close proximity to a semiconductor wafer in process. Thermal energy is absorbed by the thermal insert from the semiconductor wafer at a high rate where the spacing between the thermal insert and semiconductor wafer is at a minimum and at a gradually reduced rate where the spacing between the thermal insert and semiconductor wafer is gradually increased. A guard ring is also incorporated to negate bottom side reflective thermal energy exposure.
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申请公布号 |
US6391804(B1) |
申请公布日期 |
2002.05.21 |
申请号 |
US20000590824 |
申请日期 |
2000.06.09 |
申请人 |
PRIMAXX, INC. |
发明人 |
GRANT ROBERT W.;PETRONE BENJAMIN J.;KLOPP RONALD F.;FARLEY THEODORE E.;MUMBAUER PAUL D. |
分类号 |
H01L21/00;(IPC1-7):H01L21/324 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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