| 摘要 |
A detachable attachment base for a BGA (Ball Grid Array), CGA (Column Grid Array), LGA (Land Grid Array), or flip-chip type integrated circuit is presented. The base comprises an electrically insulating elastic mat in which a large quantity of fine electrically conductive wires, placed at a short distance from one another, are incorporated. The elastic mat is held between the first electric component and the second electric component. The base also includes means for selectively pressing the second electric component against the electrically insulating elastic mat so as to establish an electric contact between the electric components over the elastic mat. |
