| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring connection method which is capable of exhibiting superior connection of high strength. SOLUTION: A connected member 1 is mounted on a connection member 3 by the use of an anisotropic conductive film 2, the board lands 4 of the connected member 1 are connected to the bump 5 of the connection member 3 with the anisotropic conductive film 2. For film, recesses 20 have been provided previously to the anisotropic conductive film 2 at bump joint positions. Thus, superior connection of high reliability can be realized. |
