| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thin photocoupler in which positional accuracy of optical axis is high and a large diameter lens can be used. SOLUTION: A chip carrier 3 has a protruding rail guide 6 formed on the surface opposite to the surface mounting optical semiconductor elements 1 and 2. A substrate member 5 has a recessed rail groove 7 made on the surface thereof and aligned with the protruding rail guide 6. The protruding rail guide 6 is fitted in the recessed rail groove 7, the chip carrier 3 is mounted on the substrate member 5 and a lens 4 is set directly in the recessed rail groove 7 of the substrate member 5.</p> |
