| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a material having a built-in electrode which can provide enough conductivity between a power supply terminal and an electrode and can be reliably bonded with the power supply terminal without having the ceramic material damaged even if applied with a heat cycle in the temperature range of -50 to 200 deg.C, and also to provide a wafer supporting member using the same. SOLUTION: In the surface of the ceramic material 2 having a built-in electrode 4, a recess 2a is so formed as to expose part of the electrode 4. The power supply terminal 5 is inserted into the recess 2a, and the power supply terminal 5 and the recess 2a are bonded and fixed by an adhesive layer 6 formed of a resin-based adhesive containing conductive particles in the range of 10 to 90 vol.% to construct the material having a built-in electrode. A wafer installation face is formed on part of the surface of the ceramic material 2 other than part where the power supply terminal is bonded, to form the wafer supporting member.</p> |
