DEVICE FOR COOLING METAL MOLD AND OIL USING THERMOELECTRIC SEMICONDUCTOR ELEMENT

摘要

PURPOSE: A device for cooling metal mold and oil using thermoelectric semiconductor element is provided to efficiently cool the metal mold and oil. CONSTITUTION: A cooler body(100) comprises a radiation part(20) and a heat absorption part(10) integrally formed by coupling metal plates with good thermal conductivity on an endothermic side and a radiation side of a thermoelectric semiconductor element(1) with bolts. A temperature sensor(30) is formed on one side surface of the radiation part of the cooler body to detect object temperature for cooling. Fluid moving passages(11) are formed inside the heat absorption part of the cooler body for fluid cooled down by the heat absorption part to circulate through the fluid moving passages to flow inside a metal mold or oil to cool down.