| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing sheet that is used in a polishing and grinding process before a dicing process to protect and fix an electronic component assembly and also in the dicing process, and a method of using the same. SOLUTION: The dicing sheet includes a base material, an intermediate layer formed thereon, and an adhesive layer formed on the intermediate layer, wherein the adhesive layer has an elasticity at 23 deg.C of 5.0×104 to 1.0×107 Pa and the elasticity at 23 deg.C of the intermediate layer is not more than the elasticity at 23 deg.C of the adhesive layer. In a method of using the dicing sheet, the dicing sheet is placed on one surface of the electronic component assembly to fix the electronic component assembly, the other surface of the electronic component assembly is then ground and polished, and the electronic component assembly is then cut and separated, as it is, in respective electronic components. |
