发明名称 CONNECTION STRUCTURE OF INTEGRATED CIRCUIT AND MOUNTING BOARD
摘要 PROBLEM TO BE SOLVED: To reduce the loss of a mounting structure having coplanar lines different in spacing. SOLUTION: As shown at left in (a), ground lines 112, 113 with a spacing d1 are composed of a section S1 with the spacing d1, a section S2 with a spacing d2 and a section S3 connecting both in a connection part. The section S3 has through-holes H2, H3 for connecting with a not shown backside ground plate. In the drawing a signal line 111 extending from left with a width w1 is reduced thin to a width w0 to terminate within the section S1. As shown at right in (a), ground lines 122, 123 with a spacing d2 are composed of a section S2 with the spacing d2, a section S1 with a spacing d1 and a section S3 connecting both in a connection part. In the drawing a signal line 121 extending from right with a width w2 is changed to a width w0 in the section S1 and expands in the section S3. They are overlaid mutually to form a connection structure, as shown in (b).
申请公布号 JP2002141435(A) 申请公布日期 2002.05.17
申请号 JP20000334023 申请日期 2000.10.31
申请人 TOYOTA CENTRAL RES & DEV LAB INC;DENSO CORP 发明人 UDA NAONORI;TAKAYA TAKUYA
分类号 H05K1/18;H01L23/12;(IPC1-7):H01L23/12 主分类号 H05K1/18
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