| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite IC card capable of preventing the occurrence of a warp on a card even after a heat lamination process. SOLUTION: In the composite IC card including a module 201 provided with electronic parts in a card substrate 205 to execute communication in a non- contact state by electromagnetic waves and provided with a contact with a reader/writer to execute communication in a contact state by using the contact, the electrode part 203 of an antenna joined with the IC module 201 is formed like a mesh. |
