发明名称 METHOD FOR MOUNTING CONDUCTIVE BALL
摘要 PROBLEM TO BE SOLVED: To provide a means for aligning conductive balls in a prescribed array on a ball grid array base plate or the like. SOLUTION: A method for mounting the conductive ball comprises a first step of displacing and superposing perforated parts of an aligning mask 21 and a supply mask 21 having substantially the same arrays and same opening shapes, a second step of introducing the balls 1 into holes 23 of the aligning mask, and a third step of bringing the opening parts 23 and 24 of the masks 21 and 22 into coincidence and disposing the balls 1 in the prescribed array on the base plate.
申请公布号 JP2002141366(A) 申请公布日期 2002.05.17
申请号 JP20000335519 申请日期 2000.11.02
申请人 TOSHIBA CORP 发明人 TOMONO AKIRA;KAWAI KAORU;YAMAMOTO TETSUYA
分类号 H05K3/34;H01L21/60;(IPC1-7):H01L21/60 主分类号 H05K3/34
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