发明名称 |
METHOD FOR MOUNTING CONDUCTIVE BALL |
摘要 |
PROBLEM TO BE SOLVED: To provide a means for aligning conductive balls in a prescribed array on a ball grid array base plate or the like. SOLUTION: A method for mounting the conductive ball comprises a first step of displacing and superposing perforated parts of an aligning mask 21 and a supply mask 21 having substantially the same arrays and same opening shapes, a second step of introducing the balls 1 into holes 23 of the aligning mask, and a third step of bringing the opening parts 23 and 24 of the masks 21 and 22 into coincidence and disposing the balls 1 in the prescribed array on the base plate.
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申请公布号 |
JP2002141366(A) |
申请公布日期 |
2002.05.17 |
申请号 |
JP20000335519 |
申请日期 |
2000.11.02 |
申请人 |
TOSHIBA CORP |
发明人 |
TOMONO AKIRA;KAWAI KAORU;YAMAMOTO TETSUYA |
分类号 |
H05K3/34;H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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