发明名称 INSPECTION EQUIPMENT FOR SEMICONDUCTOR WAFER
摘要 PROBLEM TO BE SOLVED: To perform a highly accurate and highly stable and reliable inspection to a semiconductor wafer under a low temperature environment. SOLUTION: At the time of constituting this inspection equipment 1 for the semiconductor wafer provided with a cassette C for holding the semiconductor wafer W, and bringing probe terminals P or the like into contact with electrodes We or the like on the semiconductor wafer W altogether and an inspection device main body 2 for housing the cassette C, connecting the probe terminals P or the like and inspecting the semiconductor wafer W; the inspection equipment main body 2 is provided with a thermostatic chamber 2e for housing the cassette C, the intra-chamber temperature of the thermostatic chamber 2e is set to a first cooling temperature Te, a cooler 3 to be in contact with the cassette C housed in the thermostatic chamber 2e is provided and the cooling temperature of the cooler 3 is set to a second cooling temperature Tc.
申请公布号 JP2002141381(A) 申请公布日期 2002.05.17
申请号 JP20000337149 申请日期 2000.11.06
申请人 ORION MACH CO LTD;MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAMURA YUMIO;WAKUI MASAYUKI;EZAWA KATSUKAZU
分类号 G01R31/26;G01R31/28;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R31/26
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