发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To flexibly treat light according to the application and the usage form of a semiconductor device, so that its primary purpose can be achieved with satisfactory accuracy in the semiconductor device which is used in connection with an optical system such as an imaging apparatus. SOLUTION: The semiconductor device 50 is constituted of a semiconductor chip 30, which is worked to be thin to not to be damaged, even when it is curved and which is curved properly according to its application and its usage form and a maintenance means 40 which maintains the curved state of the semiconductor chip.
申请公布号 JP2002141253(A) 申请公布日期 2002.05.17
申请号 JP20000332764 申请日期 2000.10.31
申请人 DISCO ABRASIVE SYST LTD 发明人 SEKIYA KAZUMA
分类号 H01L27/14;H01L21/00;H01L21/02;H01L21/20;H01L21/301;H01L21/683;H01L21/762;H01L23/13;H01S5/02;H04N5/335;H04N5/369;H04N5/372;(IPC1-7):H01L21/02 主分类号 H01L27/14
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