| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wiring board which meets the flatness required for flip- chip mounting by preventing the formation of steps between copper foil and the other part of a substrate, by preventing the thickness of the substrate from increasing by the thickness of the copper foil between laminated structures holding the copper foil between insulating layers when a large-area circuit pattern for ground layer, noise reducing shield layer, etc., is formed. SOLUTION: A method for manufacturing the wiring board includes a step of integrating a plurality of insulating sheets 1 each of which is manufactured through steps of forming through holes 2 for via-hole conductors in an insulating sheet 1 containing an organic resin, of forming the via-hole conductors 3 in the through holes 2 by filling up the holes 2 with conductor paste, and of adhering a metallic circuit layer 4 to the surface or both surfaces of the sheet 1 by laminating the sheets 1 upon another. In the method, the rigidity of the insulating sheets 1 is lowered by forming through holes or non-through holes 6 which do not contribute to electrical connection in the sheets 1. |
