| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching treatment device for manufacturing a printed-wiring board with improved wiring accuracy, and a method for performing the etching treatment of a substrate for a printed-wiring board using the device. SOLUTION: In the etching treatment device for a printed-wiring board for forming a circuit by performing the etching machining of a workpiece where a part other than a printed circuit is covered with etching resist by etching liquid, at least two storage tanks of the etching liquid for storing, analyzing the constituent of, and blending the etching liquid are provided. One of them is used for supplying the etching liquid, and another is used for storing, analyzing then constituent of, and blending the etching liquid that has already been treated for securing a completely controlled etching liquid characteristics. Then, the etching liquid in the storage tank is supplied to the workpiece to be processed, the etching that has already been treated is stored, is subjected to constituent analysis, and is blended in another storage tank, thus always supplying the etching liquid whose etching liquid characteristics are completely controlled to the workpiece to be processed by the etching treatment device for a substrate for printed-wiring boards.
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