发明名称 METHOD AND DEVICE OF LIQUID TREATMENT OF PLATE MATERIAL
摘要 PROBLEM TO BE SOLVED: To solve the problem that liquid adhered to a plate opposing a plate material is not removed at the time of a gas treatment in a method of treating the material surface by consecutively supplying liquid and gas between the plate material and the plate opposed to it. SOLUTION: The periphery of the opposing plate is heated by imbedding heaters around it, irradiating it by a lamp, supplying heated liquid to it or by other methods to speed up the evaporation of the adhered liquid.
申请公布号 JP2002141326(A) 申请公布日期 2002.05.17
申请号 JP20000339145 申请日期 2000.11.01
申请人 HITACHI LTD 发明人 SAEKI TOMONORI;TAKAHARA YOICHI;DAIROKU NORIYUKI;TANAKA YUICHIRO;AIUCHI SUSUMU;OKA HITOSHI
分类号 B08B1/04;B08B3/02;B08B3/04;B08B3/08;B08B5/02;H01L21/304;(IPC1-7):H01L21/304 主分类号 B08B1/04
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