| 摘要 |
PROBLEM TO BE SOLVED: To manufacture easily a variable wavelength semiconductor light emitting device which is excellent in mass productivity. SOLUTION: A fluorescent substance chip (3) having a substrate (1) formed out of a thermoplastic resin and having a fluorescent substance layer (2) formed on the substrate (1) is prepared to provide the fluorescent substance chip (3) on a supporting member (6), and a light emitting semiconductor chip (5) is provided on the fluorescent substance chip (3). Thereafter, the substrate (1) is heated to bond to the supporting member (6) by fusion of the substrate (1) the fluorescent substance layer (2) and the light emitting semiconductor chip (5) of the fluorescent substance chip (3). Since the fluorescent substance chip (3) is previously formed, the quantity and density of the fluorescent substance in the fluorescent substance chip (3) are made uniform to make uniform the luminescent color of the semiconductor light emitting device. |
