| 摘要 |
PROBLEM TO BE SOLVED: To more easily and surely protect a semiconductor optical sensor with a glass plate in a semiconductor optical sensor package which mounts the optical sensor on a package board using a printed wiring board and a manufacturing method thereof. SOLUTION: The semiconductor optical sensor package comprises a package board using a printed wiring resin board, a semiconductor optical sensor mounted on one surface of the package board, a frame adhered to the one surface of the package board so as to surround the optical sensor, and a glass plate adhered to the opposite surface of the frame to the package board. |
