发明名称 PACKAGE FOR HOUSING DIGITAL MICROMIRROR DEVICE
摘要 PROBLEM TO BE SOLVED: To overcome the problem of a prior art such that a ceramic seal frame of a package body produces fine ceramic dust from its inner wall which obstructs a digital micromirror device from normally operating to result in no accurate image obtainable. SOLUTION: The package for housing a digital micromirror device 3 is composed of a package body 1 having a ceramic seal frame 1b surrounding a mount A for mounting the digital micromirror device 3 on an upside central part and a translucent cover 2 bonded to the upside of the seal frame 1b laminated on the upside of a ceramic tabular insulation base 1a having the mount A. The frame 1b has a center line mean roughness Ra of 2.0μm or less over its entire inner side surface.
申请公布号 JP2002141431(A) 申请公布日期 2002.05.17
申请号 JP20000331622 申请日期 2000.10.31
申请人 KYOCERA CORP 发明人 TAMARU HIDEKAZU
分类号 G02B26/08;H01L23/02;(IPC1-7):H01L23/02 主分类号 G02B26/08
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