| 摘要 |
PROBLEM TO BE SOLVED: To provide a CMP device which enables a polishing object to be polished uniformly even if a pad of a small diameter is used. SOLUTION: A triangular polishing pad whose tip is circular as shown in (a) is used. It corresponds to an idea to cut a part of an outer circumference of a polishing pad to shorten a time of contact between a polishing pad and a wafer in a wafer outer circumference without depending on an oscillation velocity. As illustrated, a circular cut-out portion of a diameter of 50 mm is provided to a center of the polishing pad. When the polishing pad is used, it is possible to divide an oscillation width into ten by using a polishing pad in realizable oscillation conditions, and to make a product of an integration value of relative linear velocity, an integration value of a pressure and an integration value of a contact time at each point in a wafer surface within ±30% inside each oscillation width, thus enabling uniform polishing. |
