MEMBER FOR WIRING CIRCUIT AND ITS MANUFACTURING METHOD, MULTILAYER INTERCONNECTION CIRCUIT BOARD, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To improve reliability in continuity between the upper and lower wiring of a bump formed in a member for wiring circuits used for manufacturing a multilayer interconnection circuit board. SOLUTION: On one main surface of a metal plate 1 made of metal foil that provides a plurality of metal bumps 3 where a vertical section is formed in a konide or trapezoidal shape at a specific position on the main surface, at least an insulating sheet 7 that is made of a synthetic resin and forms an interlayer insulating film thinner than the height of the metal bump 3, and first and second peeling sheets 8 and 9 are overlapped so that each metal bump 3 does not pass through those sheets. After that, the second peeling sheet 9 is peeled off, and the main surface of the metal plate is polished, thus eliminating a section for covering the metal bump 3 of the insulating sheet 7 so that the upper surface of the metal bump 3 is exposed by peeling off the first peeling sheet 8 for removing a foreign object 10.