| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayered wiring board which can solve the problem raised by the conventional multilayered wiring board incorporating a capacitance element that the loss of a signal current becomes higher in a high-frequency region of >=100 MHz due to the high dielectric dissipation factor of the capacitance element. SOLUTION: This multilayered wiring board 4 is constituted by laminating insulating layers 1a-1e made of an organic material and respectively carrying wiring conductors 2 on their surfaces upon another. In the wiring board 4, the capacitance element A is formed by making at least one of the insulating layers 1a-1e contain dielectric powder having a specific inductive capacity of >=20 at a rate of 10-70 vol.%, and holding the insulating layer between the wiring conductors 2 adhered to both surfaces of the element A. The wiring conductors 2 have line conductors for transmitting high-frequency signals of 100 MHz to 10 GHz in frequency. In the capacitance element A, in addition, the dielectric dissipation factors of the dielectric powder, organic material, and insulating layer are respectively adjusted to 0.001-0.02, <=0.01, and <=0.02.</p> |
