| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed-wiring board that can be manufactured by a simple process, is inexpensive, and has improved quality in circuit conductivity reliability, connection adhesion strength, and circuit position accuracy, to provide the manufacturing method of the printed-wiring board, and further to provide the printed-wiring board with a wide application range for applying to a multilayer printed-wiring board, a build-up printed-wiring board, a printed-wiring board with a cavity, and a smoothing substrate, and the like. SOLUTION: In the method for manufacturing the printed-wiring board by etching a conductive material layer in two steps, the following processes are executed, namely a first etching process for forming a circuit pattern by partially etching the partial thickness of the conductive material layer, a lamination process for burying a circuit pattern into a resin layer by laminating a circuit formation surface and the insulating resin layer, a process for forming an insulating resin layer at least between circuits of the circuit formation surface, and a second etching process for performing partial etching for leaving a desired section as needed in the remaining thick section of the conductive material on the circuit pattern, or the total surface etching of the remaining thick section.</p> |
