发明名称 MANUFACTURING METHOD OF MICRO DEVICE ARRAY SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of stably manufacturing a micro device array substrate by raising a packing factor to a substrate of a micro device. SOLUTION: Nano block devices 2 are concentrated on an Si substrate 1 and then the nano block devices are separated by etching. The separated nano block devices 2 are diffused in a liquefied carbon dioxide 4 filled in a heat- resistant/pressure-resistant vessel 3 and then allowed to contact a glass substrate 5 in which nano block device embedding holes are formed in advance. The nano block devices are packed in the embedding holes under vibration or the like. The temperature and pressure are raised to transit the liquefied carbon dioxide 4 from a liquid to a supercritical state, and then it is vaporized to dry the glass substrate 5. Lastly, a protective film 6 is formed on the glass substrate 5 so that the nano block devices 2 are fixed and each nano block device is connected together with a metal wiring 7.
申请公布号 JP2002141487(A) 申请公布日期 2002.05.17
申请号 JP20000335858 申请日期 2000.11.02
申请人 SHARP CORP;HATAMURA YOTARO 发明人 KIYOUHO MASANORI;HATAMURA YOTARO;NAKAO MASAYUKI
分类号 H01L27/12;H01L21/02;H01L21/336;H01L29/786;(IPC1-7):H01L27/12 主分类号 H01L27/12
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