| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a circuit layer-to- layer adhesive developable with an aqueous developing solution using no organic solvent, excellent in various characteristics necessary for the insulating layer of a multilayer wiring board, e.g. adhesion to a substrate and having particularly superior heat resistance and to provide a high reliability printed wiring board using the composition. SOLUTION: The photosensitive resin composition contains a compound (A) having at least one phenolic hydroxyl group and at least one acryloyl group or methacryloyl group in one molecule, a compound (B) having at least two dihydrobenzoxazine rings in one molecule and a photopolymerization initiator (C) as essential components. |
