SEMICONDUCTOR DEVICE SUPPRESSING PEELING-OFF OF CONDUCTIVE LAYER AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a united body of a lower plug and a conductive layer which can suppress the peeling-off of the conductive layer from an interlayer insulation film or the lower plug without any restrictions on the size of a pattern due to the increase in a degree of integration. SOLUTION: The semiconductor device is so structured that a lower plug 316a electrically connected to an active region of a substrate 300 may have a recess and the conductive layer connected to the lower plug includes a salient part corresponding to the recess. Due to this structure, a contact area between the lower plug and the conductive layer can be increased without the increase in contact resistance, suppressing the peel-off of the conductive layer from the lower plug or a wafer even with application of a physical shock in a conductive layer forming process and in an integration process thereafter.