MANUFACTURING METHOD FOR MULTI-LAYERED COPPER PLATE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a multi-layered copper plate which can efficiently etch away projecting copper around and in a small- diameter hole of the multi-layered copper plate and make external layer copper foil thin by etching. SOLUTION: The projection copper around and in the small-diameter hole is etched away by using a solution containing 0.5 to 10 wt.% hydrogen peroxide, 1 to 15 wt.% sulfuric acid, at least one of 0.001 to 1 wt.% tetrasol and a tetrasol derivative, and 0.005 to 0.5 wt.% phenyl uric acid at need. The surface of the copper foil is uniformly etched to make the copper thin.