| 摘要 |
PROBLEM TO BE SOLVED: To provide paste having a high heat decomposition property and high thixotropy and capable of forming a pattern having a high aspect ratio, and to provide a high-density and high-reliability ceramic multilayer wiring board and its manufacturing method using it. SOLUTION: By using this paste for pattern formation using a binder containing an organic high polymer having a branched structure, a conductor, a resistor, a dielectric and an insulating material are manufactured, and the pattern having a high aspect ratio is formed on a green sheet by a screen printing method by using them. The green sheet with the circuit pattern is laminated and sintered. |
