| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of satisfactorily dissipating heat from semiconductor elements with miniaturizing the structure and reducing the device height. SOLUTION: A semiconductor device 1 is manufactured by mounting a semiconductor element 4 in the bottom of a recess 2a formed into the downside of a first wiring board 2 with surface electrodes mutually opposed and bonded with conductor bumps 3, filling an insulative resin 5 between the bottom of the recess 2a and the semiconductor element 4, filling a metal powder 6 in the recess 2a to cover the semiconductor element 4, and bonding an exposed part of the powder 2a through the opening of the recess 2a to a radiating conductor on a second wiring board 7 through solder 8. This very efficiently conducts and disperses heat from the element 4 to the second board 7, resulting in a high-reliability and high-performance lower-height and compact semiconductor device 1. |
