发明名称 PROBE STRUCTURE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To shorten the wiring from a probe pin to a connection electrode to an inspection substrate. SOLUTION: This structure is equipped with a body substrate 7, plural probe pins 3 erected on each prescribed position on the upper face of the body substrate, plural through electrodes 5 corresponding individually to plural electrodes K1 of the inspection substrate K, and a rewiring layer 4 for connecting individually each probe pin 3 to each through electrode 5 on the upper face of the body substrate. The probe pin 3 is formed by using silicon as a core and coating a conductive film 32 on its surface. Each through electrode 5 penetrates the inside of the body substrate 7 and arrives from one face up to the other face, and a pitch between each through electrode exposed on the other face side of the body substrate 7 is set larger than a pitch between each probe pin.
申请公布号 JP2002139540(A) 申请公布日期 2002.05.17
申请号 JP20000330523 申请日期 2000.10.30
申请人 NEC CORP 发明人 TANIOKA MICHINAGA;KIMURA TAKAHIRO
分类号 G01R31/26;G01R1/06;G01R1/067;G01R1/073;H01L21/66;(IPC1-7):G01R31/26 主分类号 G01R31/26
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