| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem where assembling is difficult if the material and structure of a sheet are not appropriate for soldering when electrically grounding the sheet to reduce an electromagnetic failure by covering a wiring pattern of a printed wiring board with the sheet. SOLUTION: A wiring pattern 4 of a printed wiring board 1 is covered with a sheet 5. The sheet 5 comprises a conductive layer 14. A bracket 6 is soldered onto the printed wiring board 1. When an engagement part 8 of the bracket 6 is bent, the bracket 6 is electrically connected to the conductive layer 14 of the sheet.
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