INSPECTION EQUIPMENT FOR SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To improve the reliability of an inspection without generating pressurizing force insufficiency, to perform application even to the inspection of a semiconductor wafer with the large number of contact points of a high density memory or the like with a margin, and to improve versatility and expandability. SOLUTION: In addition to a suction means 3 for sucking the semiconductor wafer W and probe terminals P or the like held by a cassette C housed in inspection equipment main body 2 by a negative pressure, a fluid pressurizing means 4 for pressurizing the semiconductor wafer W and the probe terminals P or the like by pressure fluid A is provided.