发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To eliminate affects exerted on a wiring layout by a laser trimmable link element. SOLUTION: On the outside of a core circuit (DMR), a link circuit (1) is centralizedly arranged inside an LT link part (7), and LT link information from the LT link part (7) is transferred to a transfer control circuit (10). The serially transferred link information is converted to parallel information in the transfer control unit (10), and transferred to a latch circuit (8) arranged corresponding to a circuit requiring the LT link information inside the core circuit. |
申请公布号 |
JP2002141475(A) |
申请公布日期 |
2002.05.17 |
申请号 |
JP20000338875 |
申请日期 |
2000.11.07 |
申请人 |
MITSUBISHI ELECTRIC CORP;MITSUBISHI ELECTRIC ENGINEERING CO LTD |
发明人 |
NISHINO AIKO;WATANABE NAOYA;DOSAKA KATSUMI |
分类号 |
G11C11/407;G11C5/00;G11C7/22;G11C11/401;G11C29/00;G11C29/02;G11C29/04;H01L21/82;H01L21/822;H01L27/04 |
主分类号 |
G11C11/407 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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