| 摘要 |
PROBLEM TO BE SOLVED: To obtain a small and lightweight semiconductor package in which reflection loss is reduced significantly at the time of inputting/outputting a high frequency signal. SOLUTION: The package for containing a semiconductor element comprises a basic body 1 having a part 1a for mounting a semiconductor element 7 and a circuit board 9, on the upper surface thereof, through a mounting base 8, a metallic frame 2 being fixed onto the upper surface of the basic body 1 while surrounding the mounting part 1a and provided with a through hole 2a at the side part, and a connector 3 consisting of a tubular outer circumferential conductor 3a, a central conductor 3c and an insulator 3b interposed between and being fitted to the through hole 2a and connected electrically with the circuit board 9, wherein a part 2c of the inner surface of the frame 2 above the central part of the through hole 2a projects inward the frame 2 and the central conductor 3c is disposed such that the opposite ends thereof project from the insulator 3b and one end on the inside of the frame 2 projects inward the frame 2 from the upper surface 2c. |
