| 摘要 |
A first substrate is attached to a second substrate by providing solder structures that include a first portion adjacent the second substrate that has a first melting point, and a second portion adjacent the first substrate that has a second melting point that is lower than the first melting point. The solder structures then are heated to a first temperature that is at or above the second melting point but below the first melting point, to melt the second portions. Simultaneous with the heating of the solder structures to the first temperature, the first substrate is attached to the second substrate while the second portions are melted. Finally, the solder structures are heated to a second temperature that is above the first temperature, to alloy at least some of the first portions and the second portions. Accordingly, low temperature joining and/or positioning of the first substrate relative to the second substrate may be performed, followed by conversion of at least part of the solder structures to a higher melting point alloy, thereby allowing a reduced creep rate. |
