Verfahren und Vorrichtung zum Polieren einer dünnen Platte

摘要

A method and an apparatus, for polishing a thin plate (1) comprises the steps of: rotating a holding plate (12) on one surface (12a) of which the thin plate (1) is held; and bringing the thin plate (1) into contact with a polishing pad (7) mounted on a surface of a rotating turn table (5). However, prior to this polishing step the said one surface (12a) of the holding plate (12) is polished using the said polishing pad (7). Preferably the said one surface (12a) is also made of a material having the same polishing properties as the thin plate (1).