Cleaning semiconductor wafers after mechanical processing comprises cleaning wafers with tenside solution, rinsing with water and drying

摘要

Cleaning semiconductor wafers after mechanical processing comprises cleaning the wafers with a tenside solution; rinsing with water; and drying. Preferred Features: The tenside solution is an alkaline tenside solution, preferably containing sodium hydroxide or potassium hydroxide, or an aqueous solution, preferably an anionic tenside. The wafers are dried by gassing wit ozone.