| 摘要 |
PURPOSE: A tape bonding apparatus of a strip is provided to maximumly save expensive tape by cutting tape having a width a little bit wider than one or two strips settled on a wafer ring and attaching the tape to the strip and by straightly cutting the tape on a side surface of the wafer ring. CONSTITUTION: A tape supply/withdraw unit is mounted on a side of a main body(51), having a predetermined interval. The tape supply/withdraw unit peels the tape to which a cover film(53) is attached, supplies the peeled tape to a predetermined position and withdraws the cover film. A bonding unit(61) is transferred to the right and left by a predetermined pitch, installed on a bonding chuck. A driving unit supplies right and left transfer force to the bonding unit. A tape fixing unit(68) fixes the end portion of the supplied tape, installed in the lower portion of the bonding unit. A bonding unit moves in connection with the bonding unit, installed in one side of the bonding unit. The bonding unit supplies pressure to attach the tape fixed in the tape fixing unit to the wafer ring and the strip clamped in the bonding chuck. A cutting unit moves in connection with the bonding unit, installed in the other side of the bonding unit. The cutting unit cuts the tape from a part of the wafer ring bonded by the bonding unit.
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