发明名称 PLATEN FOR RETAINING POLISHING MATERIAL
摘要 Generally, a method and apparatus for retaining polishing material is provided. In one embodiment, the apparatus includes a platen having a top surface, a plurality of channels and one or more vacuum ports. The top surface is adapted to support the polishing material. The plurality of channels are formed in a polishing area of the top surface. The vacuum ports are disposed in the platen and at least one port is in communication with at least one of the channels. Upon application of a vacuum to the ports, the channels remove fluids under the polishing material while securing the polishing material to the top surface.
申请公布号 WO0239485(A2) 申请公布日期 2002.05.16
申请号 WO2001US43725 申请日期 2001.11.06
申请人 APPLIED MATERIALS, INC. 发明人 LI, SHIJIAN;BIRANG, MANOOCHER;EMAMI, RAMIN;NAGENGAST, ANDREW;BROWN, DOUGLAS ORCUTT,;WANG, SHI-PING;SCALES, MARTIN;WHITE, JOHN
分类号 B24B21/04;B24B37/16;B24D9/08;B25B11/00;H01L21/304;H01L21/306 主分类号 B24B21/04
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