发明名称 Method for forming gate electrode structure with improved profile and gate electrode structure therefor
摘要 A gate electrode, in which the slope of the profile of a gate electrode forming material layer, for example, a refractory metal silicide layer is prevented from being decreased due to thermal expansion by patterning a refractory metal silicide layer after performing a thermal process on a refractory metal silicide layer, thereby having a stable operation characteristic, and a method for manufacturing the same are provided.
申请公布号 US2002056917(A1) 申请公布日期 2002.05.16
申请号 US20010970536 申请日期 2001.10.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM BONG-SOO;JU BYONG-SUN;PAIK JAE-CHEOL
分类号 H01L21/28;(IPC1-7):H01L23/48 主分类号 H01L21/28
代理机构 代理人
主权项
地址