发明名称 |
Semiconductor substrate conveying module in semiconductor manufacture, has mechanical connecting elements in side walls which coact with corresponding connecting element of workstation |
摘要 |
The mechanical connecting elements (4a) of the side walls (1a-1c) which surround the substrate conveying module (1) coact with the corresponding connecting elements (4b) of the workstations (3). An Independent claim is included for a system comprising substrate conveying modules and workstations.
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申请公布号 |
DE10053232(A1) |
申请公布日期 |
2002.05.16 |
申请号 |
DE20001053232 |
申请日期 |
2000.10.26 |
申请人 |
LEICA MICROSYSTEMS JENA GMBH |
发明人 |
BIRKNER, ANDRAS;HILTAWSKI, KNUT;URBAN, KARSTEN;WIENECKE, JOACHIM |
分类号 |
H01L21/677;B65G49/07;H01L21/00;(IPC1-7):B65G49/07;H01L21/68 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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