发明名称 Semiconductor substrate conveying module in semiconductor manufacture, has mechanical connecting elements in side walls which coact with corresponding connecting element of workstation
摘要 The mechanical connecting elements (4a) of the side walls (1a-1c) which surround the substrate conveying module (1) coact with the corresponding connecting elements (4b) of the workstations (3). An Independent claim is included for a system comprising substrate conveying modules and workstations.
申请公布号 DE10053232(A1) 申请公布日期 2002.05.16
申请号 DE20001053232 申请日期 2000.10.26
申请人 LEICA MICROSYSTEMS JENA GMBH 发明人 BIRKNER, ANDRAS;HILTAWSKI, KNUT;URBAN, KARSTEN;WIENECKE, JOACHIM
分类号 H01L21/677;B65G49/07;H01L21/00;(IPC1-7):B65G49/07;H01L21/68 主分类号 H01L21/677
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