VERFAHREN ZUR HERSTELLUNG VON KARTEN MIT MEHREREN KONTAKTSPITZEN ZUM TESTEN VON HALBLEITERCHIPS

摘要

The invention relates to a process for manufacturing a card with multiple tips, designed in particular for testing semiconductor chips or integrated circuits before encapsulation thereof and comprising an oxidised silicon substrate 10 on the two opposite surfaces, one of the surfaces being provided with conducting strips connected to contacts in the form of tips 26. A thin metal layer 22 is deposited by vapour deposition in a vacuum or by cathode sputtering on one of the insulated surfaces of the monolithic substrate 10, and the conducting strips are obtained by means of a UV photolithography operation making use of a photosensitive resin, followed by etching of the thin metal layer 22 according to the location and shape of the tips 26. Another UV photolithography operation is then performed consisting in depositing a thick layer 24 of photosensitive resin on the thin etched layer, the resin then being revealed with the drawing 25 of the tips. The tips 26 are finally obtained by electroforming by means of a bath containing metal ions enabling electroformed pads corresponding to the shape of the drawings 25 to be achieved.