EQUIPMENT FOR DEPOSITING THIN FILM OF SEMICONDUCTOR WAFER

摘要

PURPOSE: Equipment for depositing a thin film of a semiconductor wafer is provided to minimize generation of particles caused by variation of an inner temperature when a semiconductor wafer is induced to a process chamber, by preheating the semiconductor wafer of a room temperature in a process for aligning a flat zone before the semiconductor wafer is loaded to the process chamber of a high temperature. CONSTITUTION: A thin film is deposited on the semiconductor wafer(10) at a high temperature in the first chamber. A preheating unit preheats the semiconductor wafer before the semiconductor wafer is loaded to the first chamber. The second chamber aligns the flat zone of the semiconductor wafer before the semiconductor wafer is loaded to the first chamber.