| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
An interconnection or active element is formed on a substrate, and an electrode pad is formed on the interconnection or active element with an interlayer insulating film therebetween. A projected electrode is formed on the surface of the electrode pad for protecting the interconnection or active element during bonding to an external terminal.
|
| 申请公布号 |
US2002056901(A1) |
申请公布日期 |
2002.05.16 |
| 申请号 |
US19990449864 |
申请日期 |
1999.11.29 |
| 申请人 |
ONO ATSUSHI;CHIKAWA YASUNORI |
发明人 |
ONO ATSUSHI;CHIKAWA YASUNORI |
| 分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L23/48;H01L23/52 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
