发明名称 |
Draht aus Goldlegierung und Herstellungsverfahren eines Höckers |
摘要 |
A gold alloy wire in which 0.2 to 5.0% by weight of palladium (Pd) and 1 to 100 ppm by weight of bismuth (Bi) are added to gold having a purity of at least 99.99% by weight. Preferably, at least one element selected from the group consisting of yttrium (Y), lanthanum (La), calcium (Ca) and beryllium (Bi) in an amount of 3 to 250 ppm by weight is further added to said gold. The gold alloy wire is especially adapted to forming a gold bump. <IMAGE> |
申请公布号 |
DE69707559(T2) |
申请公布日期 |
2002.05.16 |
申请号 |
DE1997607559T |
申请日期 |
1997.05.28 |
申请人 |
TANAKA DENSHI KOGYO K.K., TOKIO/TOKYO |
发明人 |
HIDEYUKI, AKIMOTO |
分类号 |
H01L21/60;B23K20/00;B23K35/30;C22C5/02;H01L23/49 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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