发明名称 Draht aus Goldlegierung und Herstellungsverfahren eines Höckers
摘要 A gold alloy wire in which 0.2 to 5.0% by weight of palladium (Pd) and 1 to 100 ppm by weight of bismuth (Bi) are added to gold having a purity of at least 99.99% by weight. Preferably, at least one element selected from the group consisting of yttrium (Y), lanthanum (La), calcium (Ca) and beryllium (Bi) in an amount of 3 to 250 ppm by weight is further added to said gold. The gold alloy wire is especially adapted to forming a gold bump. <IMAGE>
申请公布号 DE69707559(T2) 申请公布日期 2002.05.16
申请号 DE1997607559T 申请日期 1997.05.28
申请人 TANAKA DENSHI KOGYO K.K., TOKIO/TOKYO 发明人 HIDEYUKI, AKIMOTO
分类号 H01L21/60;B23K20/00;B23K35/30;C22C5/02;H01L23/49 主分类号 H01L21/60
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