| 摘要 |
PURPOSE: A semiconductor fabricating equipment is provided to minimize pattern errors by reducing damages of the remaining processes due to a process obstruction material. CONSTITUTION: A photoresist processing unit is formed with a plurality of process unit installed in a base body(110). The process units are formed with a wafer cassette loader unit, a wafer transfer unit, a plurality of adhesion unit(140), a plurality of cooling unit(150), a plurality of bake unit(161,162,163,164), a spin coating unit, and a developing unit. The wafer cassette loader unit is installed on an upper face of the base body(110). One or more spin coating unit and the developing unit are installed on the upper face of the base body(110). The adhesion units(140), the cooling units(150), and the bake units(161,162,163,164) are laminated on the upper face of the base body(110).
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