| 摘要 |
In a process to manufacture crisp-bread wafers, one or more edges of the wafer are made with one or more raised edges which may be linked at the corners. A slice of crisp-bread which forms part of a snack meal and is removed from a packet and placed on a flat surface. A food spread is then applied to the crisp-bread with a knife. The crisp-bread has one or more raised edges which promote clean detachment of the spread from the knife during application. The raised edge is a rounded rim. Independent claims are also included for: (1) different shapes of raised wafer edge and corrugated wafer surfaces; and (2) a packaging process |
