| 发明名称 |
Verfahren zur Montage von Halbleiterscheiben |
| 摘要 |
The invention relates to a method for assembling planar workpieces, whereby a connection, whose adhesiveness and brittleness is temperature-dependent, is made by means of a cement between the planar workpiece and a support plate. The method is characterised in that the surfaces of the support plate and the planar workpiece that are to be connected are only partially covered by the cement after the workpiece has been placed on the support plate.
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| 申请公布号 |
DE10054159(A1) |
申请公布日期 |
2002.05.16 |
| 申请号 |
DE2000154159 |
申请日期 |
2000.11.02 |
| 申请人 |
WACKER SILTRONIC GESELLSCHAFT FUER HALBLEITERMATERIALIEN AG |
发明人 |
SCHNEGG, ANTON;RURLAENDER, ROBERT;SCHNAPPAUF, MARKUS;HUEBEL, THOMAS |
| 分类号 |
B24B37/04;B24B37/30;B24B37/34;H01L21/304;H01L21/58;H01L21/68;H01L21/683;(IPC1-7):H01L21/58;F16B11/00;C30B35/00;B28D7/04 |
主分类号 |
B24B37/04 |
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