Solid-state imaging device manufacturing method incorporates electrical imaging testing function

摘要

The manufacturing method has a solid-state imaging element (9) and an optical housing mounted on a flexible printed circuit board (31), which is provided with electrical imaging testing contact terminals (33), e.g. along one circuit board edge, which are removed at the end of the testing procedure. An Independent claim for a flexible printed circuit board for a solid-state imaging device is also included.