发明名称 WAFER TRANSFER DEVICE OF SEMICONDUCTOR FABRICATING EQUIPMENT
摘要 PURPOSE: A wafer transfer device of semiconductor fabricating equipment is provided to prevent contamination and damages of a wafer by automatizing a wafer transfer process. CONSTITUTION: One or more cassette(10) is located on a table(16). A guide sensor(18) is used for guiding the cassette(10) and detecting a location of the cassette(10). A sensor(20) is installed on the table(16) in order to detect a locating state of a wafer(W) and identify processing data. The sensor(20) transmits a detecting signal to a controller(22). A robot(24) is installed in a predetermined position from the table(16) in order to load or unload the wafer(W). A chuck(26) is used for fixing selectively the wafer(W). The chuck(26) is supported by a guide member(28). A rotary member(32) is installed between a drive shaft(30) and the guide member(28). The chuck(26), the guide member(28), and the rotary member(32) are rotated selectively by the drive shaft(30). A housing cover(34) is formed on an outside of the table(16) and a wafer transfer region. A controller(22) is used for controlling operations of the robot(24). An operating portion(46) is used for applying a drive control signal of the robot(24) to the controller(22).
申请公布号 KR20020036253(A) 申请公布日期 2002.05.16
申请号 KR20000066348 申请日期 2000.11.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SEO, DAE MAN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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