发明名称 PACKAGE STRUCTURE OF SURFACE ACOUSTIC WAVE FILTER
摘要 PURPOSE: A package structure of a surface acoustic wave filter is provided to reduce a total package volume and weight of the surface acoustic wave filter and costs by connecting an electrode of each filter to an electrode connected with terminal in a package. CONSTITUTION: The package structure includes a package(10) and a surface acoustic wave filter. The package(10) includes a body portion(11) and a cover(12). One surface of the body portion(11) is open so that the surface acoustic filter is attached in the package(10). The cover(12) closes an open part of the body portion(11). The body portion(11) includes an electrode connecting terminal and an external terminal. The electrode connecting terminal protrudes from an inner side surface of the body portion(11). The external terminal is installed at an outer side surface of the package(10). The body portion(11) is electrically connected to an external circuit through the external terminal.
申请公布号 KR20020036402(A) 申请公布日期 2002.05.16
申请号 KR20000066563 申请日期 2000.11.09
申请人 LG INNOTEC CO., LTD. 发明人 BAEK, GWANG HYEON;KIM, HAN DO;LEE, GWANG RYEOL
分类号 H03H9/64 主分类号 H03H9/64
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